Multilayer capacitor and board having the same mounted thereon

ABSTRACT

A multilayer capacitor and a board having the same mounted thereon are provided. The multilayer capacitor includes a capacitor body including dielectric layers and first and second internal electrodes, and first to sixth surfaces, the first internal electrode being exposed through the third surface and the fifth surface and the second internal electrode being exposed through the fourth surface and the sixth surface; first and second side portions disposed on the fifth and sixth surfaces, respectively, of the capacitor body; first and second external electrodes; a first step-compensating portion disposed on a margin portion in a width direction on the second dielectric layer on which the second internal electrode is formed on the first internal electrode; and a second step-compensating portion disposed on another margin portion in the width direction on the first dielectric layer on which the first internal electrode is disposed on the second internal electrode.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a continuation of U.S. patent application Ser. No.16/696,030, filed on Nov. 26, 20219, which claims benefit of priority toKorean Patent Application No. 10-2019-0086962 filed on Jul. 18, 2019 inthe Korean Intellectual Property Office, the disclosures of which areincorporated herein by reference in their entireties.

TECHNICAL FIELD

The present disclosure relates to an electronic component.

BACKGROUND

Electronic components employing ceramic materials are commonlycapacitors, inductors, piezoelectric elements, varistors or thermistors,and the like.

Among these electronic components, multilayer capacitors are used invarious electronic devices as they are miniaturized and have highcapacity.

Such multilayer capacitors include a capacitor body formed of a ceramicmaterial, internal electrodes disposed inside the capacitor body, andexternal electrodes disposed on surfaces of the capacitor so as to be incontact with the internal electrodes.

In accordance with the miniaturization and multifunctionalization ofelectronic devices, there have recently been efforts to developmultilayer capacitors having thin dielectric layers and internalelectrodes and margins and covers having reduced thickness for highlylaminated products having significantly increased capacity.

However, such thinning and slimming of the margins and covers decreasereliability of the multilayer capacitors and increase likelihood ofdielectric breakdown and short circuit fault rate.

In particular, such faults occur with a higher probability at aninterface with margin portions compared to a center of the capacitorbody.

SUMMARY

An aspect of the present disclosure is to provide a multilayer capacitorcapable of obtaining above a certain level of reliability and reduceoccurrence of a step at an interface between internal electrodes andmargin portions to reduce deteriorations of reliability, the likelihoodof dielectric breakdown and a short circuit fault rate.

According to an aspect of the present disclosure, a multilayer capacitorand a board having the same mounted thereon are provided. The multilayercapacitor includes a capacitor body including first and seconddielectric layers and first and second internal electrodes, and a firstsurface and a second surface opposing each other, a third surface and afourth surface connected to the first and second surfaces and opposingeach other, and a fifth surface and a sixth surface connected to thefirst to fourth surfaces and opposing each other, the first internalelectrode being exposed through the third surface and the fifth surfaceand the second internal electrode being exposed through the fourthsurface and the sixth surface; first and second side portions disposedon the fifth and sixth surfaces, respectively, of the capacitor body;first and second external electrodes respectively disposed on the thirdand fourth surfaces of the body and respectively connected to the firstand second internal electrodes; a first step-compensating portiondisposed on a first margin portion in a width direction on the seconddielectric layer on which the second internal electrode is disposed, thefirst step-compensating portion being disposed on the first internalelectrode; and a second step-compensating portion disposed on a secondmargin portion in the width direction on the dielectric layer on whichthe first internal electrode is disposed, the second step-compensatingportion being disposed on the second internal electrode.

In an example embodiment, a thickness of each of the first and secondstep-compensating portions may be smaller than a thickness of each ofthe first and second dielectric layers.

In an example embodiment, an average thickness of each of the first andsecond internal electrodes may be 0.41 μm or less.

In an example embodiment, the first and second external electrodes mayinclude first and second connecting portions respectively disposed onthe third and fourth surfaces of the capacitor body and respectivelyconnected to the first and second internal electrodes; and first andsecond band portions respectively extending to a portion of the firstsurface of the body from the first and second connecting portions.

In an example embodiment, the first step-compensating portion and thefirst internal electrode may be made of a same material, and the secondstep-compensating portion and the second internal electrode may be madeof a same material.

In an example embodiment, the first margin portion may be a portion inwhich the first and second internal electrodes do not overlap with eachother, the first side portion may be disposed on the first marginportion, the second margin portion may be another portion in which thefirst and second internal electrodes do not overlap with each other, andthe first side portion may be disposed on the first margin portion.

In an example embodiment, the first step-compensating portion may beexposed from the third and fifth surfaces, and the secondstep-compensating portion may be exposed from the fourth and sixthsurfaces

According to an aspect of the present disclosure, a board having amultilayer capacitor mounted thereon includes a board comprising firstand second electrode pads on one surface; and the multilayer capacitor,where the first and second external electrodes are mounted on the firstand second electrode pads to be connected thereto.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription, taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a schematic perspective view of a multilayer capacitoraccording to an example embodiment of the present disclosure;

FIG. 2A is a cross-sectional view taken along line I-I′ of FIG. 1according to an example embodiment of the present disclosure;

FIG. 2B is a cross-sectional view taken along line I-I′ of FIG. 1according to a modified embodiment of the present disclosure;

FIG. 3 is a cross-sectional view taken along line II-II′ of FIG. 1;

FIG. 4A is a plan view of first and second internal electrodes of amultilayer ceramic capacitor according to an exemplary embodiment;

FIG. 4B is a plan view of first and second internal electrodes of amultilayer ceramic capacitor according to a modified embodiment; FIG. 5Ais a plan view illustrating the first and second internal electrodesbeing overlapped according to an example embodiment of the presentdisclosure;

FIG. 5B is a plan view illustrating the first and second internalelectrodes being overlapped according to a modified embodiment of thepresent disclosure;

FIG. 6 is a schematic perspective view of a structure of a multilayercapacitor in which first and second internal electrodes are laminated;and

FIG. 7 is a perspective view of the multilayer capacitor of FIG. 1mounted on a board.

DETAILED DESCRIPTION

Hereinafter, embodiments of the present disclosure will be described asfollows with reference to the attached drawings.

However, the invention may be embodied in many different forms andshould not be construed as being limited to the embodiments set forthherein.

Rather, these embodiments are provided so that this disclosure will bethorough and complete, and will fully convey the scope of the inventionto those skilled in the art.

Accordingly, the shapes and dimensions of elements in the drawings maybe exaggerated for clarity, and the same reference numerals will be usedthroughout to designate the same or like elements.

Further, the same reference numerals are used throughout the drawingsfor the elements having similar functions and activities.

In the specification, unless otherwise specifically indicated, when acertain part “includes” a certain component, it is understood that othercomponents may be further included but are not excluded.

To clearly describe the example embodiments, X, Y and Z indicated in thedrawings are defined to represent a length direction, a width directionand a thickness direction, respectively, of the multilayer capacitor.

Additionally, the Z direction may be used in the same sense as alamination direction in which the dielectric layers are stacked up.

FIG. 1 is a schematic perspective view of a multilayer capacitoraccording to an example embodiment of the present disclosure. FIG. 2A isa cross-sectional view taken along line I-I′ of FIG. 1 according to anexample embodiment of the present disclosure. FIG. 2B is across-sectional view taken along line I-I′ of FIG. 1 according to amodified embodiment of the present disclosure. FIG. 3 is across-sectional view taken along line II-II′ of FIG. 1. FIG. 4A is aplan view of first and second internal electrodes of a multilayerceramic capacitor according to an exemplary embodiment. FIG. 4B is aplan view of first and second internal electrodes of a multilayerceramic capacitor according to a modified embodiment. FIG. 5A is a planview illustrating the first and second internal electrodes beingoverlapped according to an embodiment. FIG. 5B is a plan viewillustrating the first and second internal electrodes being overlappedaccording to a modified embodiment. FIG. 6 is a schematic perspectiveview of a structure of a multilayer capacitor in which first and secondinternal electrodes are laminated. FIG. 7 is a perspective view of themultilayer capacitor of FIG. 1 mounted on a board.

Referring to FIGS. 1, 2A, 3, 4A, 5A, and 6, a multilayer capacitor 100according to an exemplary embodiment of the present disclosure includesa capacitor body 110 including dielectric layers 111 and first andsecond internal electrodes 121 and 122, first and second side portions141 and 142, first and second external electrodes 131 and 132, and firstand second step-compensating portions 121 a and 122 a.

The capacitor body 110 is formed by laminating a plurality of thedielectric layers 111 in the Z direction and plasticizing the same. Aconfiguration and a size of such capacitor body 110 and a number of thelaminated dielectric layers 111 are not limited to those illustrated inthe drawings.

Further, a plurality of the dielectric layers 111 forming the capacitorbody 110 are sintered, and may be integrated with each other so thatboundaries between adjacent dielectric layers 111 are not readilyapparent without using a scanning electron microscope (SEM).

The configuration of the capacitor body 110 is not particularly limited,but may be hexahedral.

For convenience of description, surfaces of the capacitor body 110opposing each other are defined as first and second surfaces 1 and 2,those opposing each other and connected to the first and second surfaces1 and 2 are defined as third and fourth surfaces 3 and 4, and thoseopposing each other and connected to the first to fourth surfaces 1 to 4are defined as fifth and sixth surfaces 5 and 6.

The dielectric layers 111 may contain ceramic powder, for example,BaTiO₃-based ceramic powder, or the like.

The BaTiO₃-based ceramic powder may be (Ba_(1-x)Ca_(x))TiO₃, Ba(Ti_(1-y)Ca_(y))O₃, (Ba_(1-x)Ca_(x)) (Ti_(1-y)Zr_(y))O₃ or Ba(Ti_(1-y)Zr_(y))O₃, or the like, in which calcium (Ca), zirconium (Zr),or the like, is included in BaTiO₃ (BT), but is not limited thereto.

In addition to the ceramic powder, a ceramic additive, an organicsolvent, a plasticizer, a binder and a dispersant, or the like, may befurther included in the dielectric layers 111.

The ceramic additive may include, for example, a transition metal oxideor a transition metal carbide, rare-earth element, magnesium (Mg),aluminum (Al), or the like.

The capacitor body 110 may include an active region including the firstand second internal electrodes 121 and 122 and the dielectric layers 111as a portion contributing to generation of capacity of a capacitor, andupper and low cover regions 112 and 113 disposed on upper and lowersurfaces of the active region as a margin portion.

The upper and lower cover regions 112 and 113 may be formed of amaterial and may have a configuration the same as those of thedielectric layers 111 of the active region, except that the upper andlower cover regions 112 and 113 do not include internal electrodes. Theupper and lower cover regions 112 and 113 may be formed by laminating asingle dielectric layer or at least two dielectric layers on an uppersurface and a lower surface of the active region in the Z direction.

Such upper and lower cover regions 112 and 113 may prevent damage to thefirst and second internal electrodes 121 and 122 caused by physical orchemical stress.

The first and second internal electrodes 121 and 122 are electrodeshaving different polarities and are formed by printing a conductivepaste containing a conductive metal on the dielectric layers to apredetermined thickness.

The first and second internal electrodes 121 and 122 may be alternatelylaminated in the lamination direction with respective dielectric layers111 interposed therebetween, and may be electrically insulated by thedielectric layers 111 interposed therebetween.

The first internal electrode 121 is formed to expose through the thirdand fifth surfaces 3 and 5 of the capacitor body 110.

The first internal electrode 121 maybe exposed through a cornerconnecting the third and fifth surfaces 3 and 5 of the capacitor body110.

The first step-compensating portion 121 a is formed on a margin portionin a Y direction on the dielectric layer on which the second internalelectrode 122 is formed on the first internal electrode 121.

The first step-compensating portion 121 a may be formed to extend to anupper surface of the first internal electrode 121 in the Z direction.For example, the first step-compensating portion 121 a may be made ofthe same material as the first internal electrode 121. The presentdisclosure, however, is not limited thereto. For another example, thefirst step-compensating portion 121 a and the dielectric layer 111 maybe made of the same material.

A thickness of the first step-compensating portion 121 a maybe the sameas or smaller than that of the dielectric layer 111.

If the first step-compensating portion 121 a is thicker than thedielectric layer 111, the first step-compensating portion 121 a may giverise to a concave shape due to hyper-compensation, thereby causing anexterior defect of the capacitor body 110.

The second internal electrode 122 is formed to expose through the fourthand sixth surfaces 4 and 6 of the capacitor body 110.

The second internal electrode 122 may be exposed through a cornerconnecting the fourth and sixth surfaces 4 and 6 of the capacitor body110.

The second step-compensating portion 122 a may be formed on a marginportion in a Y direction on the dielectric layer on which the firstinternal electrode 121 is formed on the second internal electrode 122.For example, the second step-compensating portion 122 a may be made ofthe same material as the second internal electrode 122. The presentdisclosure, however, is not limited thereto. For another example, thesecond step-compensating portion 122 a and the dielectric layer 111 maybe made of the same material.

The second step-compensating portion 122 a may be formed to extend to anupper surface of the second internal electrode 122 in the Z direction.

A thickness of the second step-compensating portion 122 a may be thesame as or less than that of the dielectric layer 111.

If the second step-compensating portion 122 a is thicker than thedielectric layer 111, the second step-compensating portion 122 a maygive rise to a concave shape due to hyper-compensation, thereby causingan exterior defect of the capacitor body 110.

In other words, the first and second internal electrodes 121 and 122 areconfigured to be alternately offset in the Y direction viewed on a Y-Zplane of the capacitor body 110 in order to reduce difference in densitybetween the active region in which the internal electrodes are formedand the margin portions in which the internal electrodes are not formed.

As in the exemplary embodiment, the presence of the first and secondinternal electrodes 121 and 122 gives rise to not only an increasedbasic surface area of the first and second internal electrodes 121 and122 but also an increased surface area of an overlapping area of thefirst and second internal electrodes 121 and 122, thereby increasingcapacity of the multilayer capacitor 100.

Further, the first and second step-compensating portions 121 a and 122 areduce a step generated by the internal electrodes and thus increaseaccelerated life of insulation resistance, thereby preventingdelamination between layers or occurrence of a crack and deteriorationof reliability of high temperature acceleration and moisture resistanceloading. By enhancing BDV characteristics, insulation breakdown may alsobe prevented.

The first and second internal electrodes 121 and 122 may be in contactwith and electrically connected to the first and second externalelectrodes 131 and 132, respectively, through the portion exposedthrough the third and fourth surfaces 3 and 4 of the capacitor body 110.

Accordingly, when voltage is applied to the first and second externalelectrodes 131 and 132, charge is accumulated between the first andsecond internal electrodes 121 and 122 facing each other.

Capacitance of the multilayer capacitor 100 is proportional to thesurface area of the area where the first and second internal electrodesoverlap.

One of silver (Ag), palladium (Pd), platinum (Pt), nickel (Ni) andcopper (Cu) or alloys thereof may be used for the conductive metalcontained in the conductive paste forming the first and second internalelectrodes 121 and 122, but it is not limited thereto.

A method for printing the conductive paste may be a screen-printingmethod, a gravure printing method, or the like, but is not limitedthereto.

A first side portion 141 is disposed on the fifth surface 5 of thecapacitor body 110.

The first side portion 141 is in contact with the fifth surface 5 of thecapacitor body 110 so as to cover the portion exposed through the fifthsurface 5 of the capacitor body 110 in the first internal electrode 121.

The first side portion 141 may be formed of ceramic slurry or aninsulating polymer material, or the like, but is not limited thereto.

Such first side portion 141 may compensate a margin on the fifth surface5 of the capacitor body 110 in the Y direction, which is reduced by theoffset arrangement of the first internal electrode 121.

A second side portion 142 is disposed on the sixth surface 6 of thecapacitor 110.

Further, the second side portion 142 in contact with the sixth surface 6of the capacitor body 110 so as to cover the portion exposed through thesixth surface 6 of the capacitor body 110 in the second internalelectrode 122.

The second side portion 142 may be formed of ceramic slurry or aninsulating polymer material, or the like, but is not limited thereto.

Such second side portion 142 may compensate a margin on the sixthsurface 6 of the capacitor body 110 in the Y direction, which is reducedby the offset arrangement of the second internal electrode 122.

The first and second side portions 141 and 142 may protect the capacitorbody 110 and the first and second internal electrodes 121 and 122 fromexternal shock, or the like, and secure insulativity and moistureresistance reliability around the capacitor body 110.

The first and second external electrodes 131 and 132 are provided withvoltage with different polarities and are disposed on the third andfourth surfaces 3 and 4 of the capacitor body 110, and are respectivelyconnected to the portion of the first and second internal electrodes 121and 122, which is exposed through the third and fourth surfaces 3 and 4of the capacitor body 110.

The first external electrode 131 may include a first connection portion131 a and a first band portion 131 b.

The first connection portion 131 a is disposed on the third surface 3 ofthe capacitor body 110 and is in contact with an end portion of thefirst internal electrode 121, which is exposed externally through thethird surface 3 of the capacitor body 110, to physically andelectrically connect the first internal electrode 121 and the firstexternal electrode 131.

The first band portion 131 b extends from the first connection portion131 a to a portion of the first surface 1 of the capacitor body 110.

The first band portion 131 b, if necessary, may further extend towardthe second, fifth and sixth surfaces 2, 5 and 6 of the capacitor body110 so as to partially cover one end portion of the first and secondside portions 141 and 142 for improvement of adhesive strength.

The second external electrode 132 may include a second connectionportion 132 a and a second band portion 132 b.

The second connection portion 132 a is disposed on the fourth surface 4of the capacitor body 110 and is in contact with an end portion of thesecond internal electrode 122, which is exposed externally through thefourth surface 4 of the capacitor body 110, to physically andelectrically connect the second internal electrode 122 and the secondexternal electrode 132.

The second band portion 132 b extends from the first connection portion132 a to a portion of the first surface 1 of the capacitor body 110.

The second band portion 132 b, if necessary, may further extend towardthe second, fifth and sixth surfaces 2, 5 and 6 of the capacitor body110 so as to partially cover the other end portion of the first andsecond side portions 141 and 142 for improvement of adhesive strength.

Such first and second external electrodes 131 and 132 may be formed by aconductive paste containing a conductive metal.

The conductive metal may be Ag, Ni, Cu or alloys thereof, but is notlimited thereto.

Meanwhile, a plating layer (not illustrated) may be formed on the firstand second external electrodes 131 and 132, if necessary.

The plating layer is for improvement of mutual adhesive strength betweenthe multilayer capacitor 100 and a printed circuit board when mountingthe multilayer capacitor 100 on the printed circuit board as a solder.

Such a plating layer may have a structure in which a nickel (Ni)-platinglayer is formed on the first and second external electrodes 131 and 132and a tin (Sn)-plating layer is formed on the Ni-plating layer, but isnot limited thereto.

Meanwhile, in the exemplary embodiment, an average thickness of thefirst and second internal electrodes 121 and 122 may be 0.41 μm or less.

The multilayer capacitor 100 of the exemplary embodiment has a structurein which the first and second internal electrodes 121 and 122 areexposed through the fifth and sixth surfaces 5 and 6 of the capacitorbody 110.

Referring to FIGS. 2B, 4B, and 5B, a multilayer capacitor according to amodified embodiment of the present disclosure may further include thirdand fourth step-compensating portions 121 b and 122 b, as compared tothe above-described embodiment. A detailed description of the contentsoverlapping those described above is thus omitted.

The third step-compensating portion 121 b and the fourthstep-compensating portion 122 b maybe disposed on opposing edge portionsof the capacitor body 110 in an X direction.

The third step-compensating portion 121 b is formed on an edge portionin the X direction on the dielectric layer on which the second internalelectrode 122 is formed on the first internal electrode 121. The thirdstep-compensating portion 121 b may be exposed from the third surface 3and be spaced apart from the second internal electrode 122. The thirdstep-compensating portion 121 b may extend from the firststep-compensating portion 121 a in the Y direction.

The third step-compensating portion 121 b may be formed to extend to anupper surface of the first internal electrode 121 in the Z direction.For example, the third step-compensating portion 121 b may be made ofthe same material as the first internal electrode 121. The presentdisclosure, however, is not limited thereto. For another example, thethird step-compensating portion 121 b and the dielectric layer 111 maybe made of the same material.

A thickness of the third step-compensating portion 121 b may be the sameas or smaller than that of the dielectric layer 111.

If the third step-compensating portion 121 b is thicker than thedielectric layer 111, the third step-compensating portion 121 b may giverise to a concave shape due to hyper-compensation, thereby causing anexterior defect of the capacitor body 110.

The fourth step-compensating portion 122 b may be formed on another edgeportion in the X direction on the dielectric layer on which the firstinternal electrode 121 is formed on the second internal electrode 122.For example, the fourth step-compensating portion 122 b may be made ofthe same material as the second internal electrode 122. The presentdisclosure, however, is not limited thereto. For another example, thefourth step-compensating portion 122 b and the dielectric layer 111 maybe made of the same material. The fourth step-compensating portion 122 bmay be exposed from the fourth surface 4 and be spaced apart from thefirst internal electrode 121. The fourth step-compensating portion 122 bmay extend from the second step-compensating portion 122 a in the Ydirection.

The fourth step-compensating portion 122 b may be formed to extend to anupper surface of the second internal electrode 122 in the Z direction.

A thickness of the fourth step-compensating portion 122 b may be thesame as or less than that of the dielectric layer 111.

If the fourth step-compensating portion 122 b is thicker than thedielectric layer 111, the fourth step-compensating portion 122 b maygive rise to a concave shape due to hyper-compensation, thereby causingan exterior defect of the capacitor body 110.

Accordingly, as the margin portions are alternately laminated in the Ydirection, saddle generated around the side portions of conventionalmultilayer capacitor can be resolved by reducing occurrence of a step inthe end portions of the internal electrodes.

In addition, reliability would not be an issue even when the thicknessof the first and second internal electrodes 121 and 122 is reduced andmultilayered. In this regard, reliability can be secured for themultilayer capacitor 100 and capacity thereof can be increased.

Based on FIG. 7, a board, on which the multilayer capacitor of theexemplary embodiment is mounted, includes a board 210 having first andsecond electrode pads 221 and 222 on one surface thereof and amultilayer capacitor 100 mounted on a top surfaces of the board 210 soas that the first and second external electrodes 131 and 132 areconnected to the first and second electrode pads 221 and 222,respectively.

In the exemplary embodiment, the multilayer capacitor 100 is illustratedand described as being mounted on the board 210 by solders 231 and 232;however, if necessary, a conductive paste may be used instead thereof.

According to the present disclosure, due to the side portionsadditionally attached after the internal electrodes are exposed throughone surface of the capacitor body in the width direction, the surfacearea of the overlapped area of the internal electrodes is maximized,thereby increasing the capacity of the multilayer capacitor. Further,step-compensating portions are formed in the margin portions in thewidth direction, in which the internal electrodes are facing each other,so that occurrence of a step at an interface between the internalelectrodes and the margin portions is reduced. Accordingly,deterioration of reliability of the multilayer capacitor and likelihoodof dielectric breakdown and short circuit fault rate can be reduced.

While example embodiments have been shown and described above, it willbe apparent to those skilled in the art that modifications andvariations could be made without departing from the scope of the presentdisclosure as defined by the appended claims.

What is claimed is:
 1. A multilayer capacitor, comprising: a capacitorbody comprising first and second dielectric layers and first and secondinternal electrodes, and a first surface and a second surface opposingeach other, a third surface and a fourth surface connected to the firstand second surfaces and opposing each other, and a fifth surface and asixth surface connected to the first to fourth surfaces and opposingeach other, the first internal electrode being exposed through the thirdsurface and the fifth surface and the second internal electrode beingexposed through the fourth surface and the sixth surface; first andsecond side portions disposed on the fifth and sixth surfaces,respectively, of the capacitor body; first and second externalelectrodes respectively disposed on the third and fourth surfaces of thebody and respectively connected to the first and second internalelectrodes; a first step-compensating portion disposed on a first marginportion in a width direction on the second dielectric layer on which thesecond internal electrode is disposed, the first step-compensatingportion being disposed on the first internal electrode; and a secondstep-compensating portion disposed on a second margin portion in thewidth direction on the first dielectric layer on which the firstinternal electrode is disposed, the second step-compensating portionbeing disposed on the second internal electrode, wherein a thickness ofeach of the first and second step-compensating portions is smaller thana thickness of each of the first and second dielectric layers.
 2. Themultilayer capacitor of claim 1, wherein the first and second externalelectrodes comprise: first and second connecting portions respectivelydisposed on the third and fourth surfaces of the capacitor body andrespectively connected to the first and second internal electrodes; andfirst and second band portions respectively extending to a portion ofthe first surface of the body from the first and second connectingportions.
 3. The multilayer capacitor of claim 1, wherein the firststep-compensating portion and the first internal electrode are made of asame material, and the second step-compensating portion and the secondinternal electrode are made of a same material.
 4. The multilayercapacitor of claim 1, wherein the first margin portion is a portion inwhich the first and second internal electrodes do not overlap with eachother, the first side portion is disposed on the first margin portion,the second margin portion is another portion in which the first andsecond internal electrodes do not overlap with each other, and thesecond side portion is disposed on the second margin portion.
 5. Themultilayer capacitor of claim 1, wherein the first step-compensatingportion is exposed from the third and fifth surfaces, and the secondstep-compensating portion is exposed from the fourth and sixth surfaces.6. The multilayer capacitor of claim 1, further comprising: a thirdstep-compensating portion disposed on an edge portion in a lengthdirection on the second dielectric layer on which the second internalelectrode is disposed, the third step-compensating portion beingdisposed on the first internal electrode; and a fourth step-compensatingportion disposed on another edge portion in the length direction on thefirst dielectric layer on which the first internal electrode isdisposed, the fourth step-compensating portion being disposed on thesecond internal electrode.
 7. The multilayer capacitor of claim 6,wherein the third step-compensating portion extends from the firststep-compensating portion in the width direction, and the fourthstep-compensating portion extends from the second step-compensatingportion in the width direction.
 8. The multilayer capacitor of claim 6,wherein the third step-compensating portion is exposed from the thirdsurface, and the fourth step-compensating portion is exposed from thefourth surface.
 9. A multilayer capacitor, comprising: a capacitor bodycomprising first and second dielectric layers and first and secondinternal electrodes, and a first surface and a second surface opposingeach other, a third surface and a fourth surface connected to the firstand second surfaces and opposing each other, and a fifth surface and asixth surface connected to the first to fourth surfaces and opposingeach other, the first internal electrode being exposed through the thirdsurface and the fifth surface and the second internal electrode beingexposed through the fourth surface and the sixth surface; first andsecond side portions disposed on the fifth and sixth surfaces,respectively, of the capacitor body; first and second externalelectrodes respectively disposed on the third and fourth surfaces of thebody and respectively connected to the first and second internalelectrodes; a first step-compensating portion disposed on a first marginportion in a width direction on the second dielectric layer on which thesecond internal electrode is disposed, the first step-compensatingportion being disposed on the first internal electrode; and a secondstep-compensating portion disposed on a second margin portion in thewidth direction on the first dielectric layer on which the firstinternal electrode is disposed, the second step-compensating portionbeing disposed on the second internal electrode, wherein an averagethickness of each of the first and second internal electrodes is 0.41 μmor less.
 10. The multilayer capacitor of claim 9, wherein the first andsecond external electrodes comprise: first and second connectingportions respectively disposed on the third and fourth surfaces of thecapacitor body and respectively connected to the first and secondinternal electrodes; and first and second band portions respectivelyextending to a portion of the first surface of the body from the firstand second connecting portions.
 11. The multilayer capacitor of claim 9,wherein the first step-compensating portion and the first internalelectrode are made of a same material, and the second step-compensatingportion and the second internal electrode are made of a same material.12. The multilayer capacitor of claim 9, wherein the first marginportion is a portion in which the first and second internal electrodesdo not overlap with each other, the first side portion is disposed onthe first margin portion, the second margin portion is another portionin which the first and second internal electrodes do not overlap witheach other, and the second side portion is disposed on the second marginportion.
 13. The multilayer capacitor of claim 9, wherein the firststep-compensating portion is exposed from the third and fifth surfaces,and the second step-compensating portion is exposed from the fourth andsixth surfaces.
 14. The multilayer capacitor of claim 9, furthercomprising: a third step-compensating portion disposed on an edgeportion in a length direction on the second dielectric layer on whichthe second internal electrode is disposed, the third step-compensatingportion being disposed on the first internal electrode; and a fourthstep-compensating portion disposed on another edge portion in the lengthdirection on the first dielectric layer on which the first internalelectrode is disposed, the fourth step-compensating portion beingdisposed on the second internal electrode.
 15. The multilayer capacitorof claim 14, wherein the third step-compensating portion extends fromthe first step-compensating portion in the width direction, and thefourth step-compensating portion extends from the secondstep-compensating portion in the width direction.
 16. The multilayercapacitor of claim 14, wherein the third step-compensating portion isexposed from the third surface, and the fourth step-compensating portionis exposed from the fourth surface.